需要更多更详细的应用来分析判断单片集成或者共封集成的优劣
Source: Kevin J. Chen, Oliver Häberlen, Alex Lidow, Chun lin Tsai, Tetsuzo Ueda, Yasuhiro Uemoto and Yifeng Wu, GaN-on-Si Power Technology:, Devices and Applications IEEE
TRANSACTIONS ON ELECTRON DEVICES, VOL. 64, NO. 3, MARCH 2017
Tel:+86-025-51180705
Email:xinkansen@x-ipm.com
WeChat public account:X-IPM Technologies