MANUFACTURING

THINKANTECH YANCHENG FACTORY IS AN ADVANCED POWER MODULE PACKAGING FACILITY. WITH MATURE AND ADVANCED PACKAGING PROCESSES, WE PROVIDE EFFICIENT AND RELIABLE PACKAGING SERVICES, OFFERING CUSTOMERS HIGH QUALITY AND PROFESSIONAL MODULE PACKAGING SOLUTIONS.OUR ADVANCED PROCESSES AND EXPERT TECHNOLOGY ALLOW US TO QUICKLY RESPOND TO CUSTOMIZED REQUIREMENT.

ADVANCED POWER SEMICONDUCTOR MODULE PACKAGING FACILITY

Jiangsu THINKANTECH Yancheng factory is FORMITEK’s strategic facility in power module packaging and system integration. It focuses on the research and development of IGBT modules, IPM (Intelligent Power Modules), and SiC hybrid modules. It also provides customized packaging designs and thermal management solutions. In order to build a high quality product line covering automotive grade and industrial grade standards, the factory has introduced multiple sets of high precision, high reliability production and testing equipment.

High precision placement machines with micron-level positioning ensure accurate alignment of chips and substrates, vacuum reflow ovens maintain soldering stability through controlled environments and stepwise temperature control. Aluminum/copper wire bonding machines enable efficient electrical connections. Dedicated testing machines simulate harsh operating conditions to perform comprehensive performance evaluation.

With superior products and technical support, Jiangsu THINKANTECH serves applications such as electric vehicle drive systems, energy storage inverters, and high-end equipment manufacturing, fully committed to advancing the domestic substitution of power modules.

High Precision Placement Machine AUTOTRONIC

Equipped with a Japanese dual-vision alignment chip placer, the placement accuracy reaches ±0.015 mm. The gap between the chip and the Direct Bonded Copper (DBC) substrate is controlled within 5 µm. Customized vacuum suction nozzles and flexible pressure control achieve precise pressure adjustment from 0.1 g to 5 g, effectively avoiding the risk of hidden chip cracks. The placement yield rate is stably above 99.8%, laying the core foundation for the module’s electrical conduction and thermal conductivity efficiency.

High Cleanliness Vacuum Reflow Oven

CENTROTHERM vacuum reflow oven creates a high vacuum soldering environment of below 8 Pa. Oxygen concentration is strictly controlled below 30 ppm to prevent oxidation from the source. The solder joint void rate is precisely controlled under 0.3% (industry average: 3% to 5%). The system features a 32-zone independent temperature control system with a temperature ramp rate accuracy of ±0.3°C/s and soldering peak temperature fluctuation within ±0.8°C, achieving sub-micron metallurgical bonding between the chip and DBC substrate. Shear strength testing of solder joints shows a 50% increase in bonding strength. The joints can withstand thermal cycling from -55°C to 150°C for 1500 cycles without failure, fully meeting the durability and high reliability requirements of new energy vehicle power modules, industrial inverter equipment, and other long-life applications

High Precision Aluminum Wire Bonding Machine

Imported high-precision bonding machine HESSE BJ955, achieving a bonding position repeatability accuracy of ±0.005 mm, with bonding strength variation controlled within 5%. Using 99.99% high-purity oxygen-free aluminum wire (diameter 0.2–0.8 mm), after parameter optimization, the current-carrying capacity of a single aluminum wire is increased by 25%, and the module’s long-term current reliability is improved by 30%.

Comprehensive Testing Machine

Equipped with a Lemsys professional static and dynamic test system, the platform achieves a static force measurement accuracy of ±0.5% FS, a dynamic force test frequency range of 0.1–500 Hz, and a displacement measurement resolution of ≤0.1 μm, ensuring data accuracy from the very source. A 16-channel synchronous acquisition system with a sampling rate of up to 1 MHz and data acquisition latency of ≤10 μs enables millisecond-level dynamic capture of material mechanical properties. Verified through authoritative calibration, the system maintains a long-term test stability error of <0.3% and can withstand 800 environmental temperature cycles from -20°C to 80°C without drift. It fully meets the high-precision mechanical testing requirements of automotive components, aerospace structural parts, and electronic devices, providing critical data support for product reliability validation.

PROCESS FLOW

YANCHENG FACTORY FOCUSES ON MODULE PACKAGING AND TESTING

Yancheng factory focuses on module
packaging and testing

CHIP MOUNTING PROCESS

Our positioning accuracy reaches ±0.015 mm, with multiple nozzles and customizable adaptation for chips of various thicknesses and specifications.

We can precisely align the chip with the electrodes of the DBC (Direct Bonded Copper) substrate, preventing misalignment that could cause poor electrical connections, and providing a stable foundation for subsequent soldering and bonding processes.

ALUMINUM WIRE BONDING

We are capable of bonding aluminum and copper wires with diameters from 50 µm to 600 µm, achieving a positional repeatability of ±0.005 mm, while keeping bond-strength variation strictly within 5%.

Capable of achieving micrometer-level connections between aluminum wires, chips, and substrates, laying the foundation for stable electrical signal transmission in modules. Using a multi-strand parallel aluminum wire bonding design, parasitic inductance is reduced to below 5 nH, effectively minimizing signal interference under high-frequency conditions.

FORMIC-ACID REFLOW SOLDERING

Our power modules have excellent temperature uniformity at ±0.5%, single-solder-joint void rate ≤ 0.5%, and a 15% reduction in thermal resistance of the solder layer.

As a key process for soldering IGBT chips to DBC substrates, formic-acid vacuum reflow soldering achieves flux-free soldering through a dual effect of ‘formic-acid reduction + high-vacuum environment,’ preventing electrical corrosion caused by residues. The solder joint surface cleanliness reaches 99.9%, providing a solid foundation for the long-term current-carrying reliability of the module.

DYNAMIC/STATIC TESTING

Our power modules are equipped with a high precision measurement module, with a voltage testing range of 0 to 3000 V and a current testing range of 0 to 2000 A. The sampling rate reaches up to 20 GSa/s, testing bandwidth covers DC to 1 GHz, and it can simulate high frequency switching conditions from 5 kHz to 2 MHz

As the ‘key quality checkpoint’ before IGBT modules leave the factory, it comprehensively tests both static characteristics (such as breakdown voltage and gate threshold voltage) and dynamic characteristics (such as switching delay time, di/dt, dv/dt). This ensures that only modules meeting precise parameter standards are delivered, preventing underperforming products from entering downstream applications.

KEY PRODUCTS

THINKANTECH SPECIALIZES IN WIDE BANDGAP SEMICONDUCTOR TECHNOLOGIES (GAN/SIC), OUR PRODUCTS APPLICATIONS INCLUDE FAST CHARGING, ENERGY STORAGE SYSTEMS, AUTOMOTIVE ELECTRONICS, AND AI COMPUTING.

DEVELOPMENT PLAN

WE DEVELOP HIGHLY RELIABLE POWER MODULES TO MEET THE DEMANDS OF MARINE ELECTRONICS, STRIVING TO BECOME THE TOP BRAND IN FUTURE MARINE ELECTRONIC EQUIPMENT.
WE CREATE HIGH EFFICIENCY, HIGH POWER DENSITY POWER MODULES TO ADDRESS THE EVOLVING DEMANDS OF THE BATTERY INDUSTRY.
WE DESIGN EFFICIENT POWER MODULES FOR AI COMPUTING AND SMART TERMINALS.
WE INNOVATIVELY TACKLE HIGH EFFICIENCY ENERGY CONVERSION CHALLENGES TO MEET THE NEW DEMANDS OF SMART HOME APPLIANCES.

Leveraging “cutting-edge equipment, patented processes, and automotive grade standards” as its competitiveness, THINKANTECH’s Yancheng factory supports high efficiency mass production of power modules for consumer electronics, industrial energy storage, and new energy vehicles through technological innovations such as copper-clip heat dissipation and oxide-layer control. With an annual planned capacity of 1 million units and a 1700 V high voltage platform in place, the Yancheng factory is becoming a strategic pivot for THINKANTECH to break monopolies and achieve domestic substitution.

ENGINEER AT A TECHNOLOGY COMPANY

MR. LIU, SENIOR ENGINEER

THINKANTECH SIGNIFICANTLY ENHANCES PRODUCT ENERGY EFFICIENCY WITH THE POWER OF OUR WIDE BANDGAP SEMICONDUCTORS

WE ARE ALWAYS HERE TO SUPPORT YOU. WE HELP TURN YOUR CHALLENGES INTO OUR OPPORTUNITIES FOR GROWTH AND SUCCESS. CONTACT US ANYTIME TO START THE CONVERSATION.

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