LOW ALTITUDE AVIATION

Due to their ability to operate under high voltage, high temperature, and high frequency conditions, wide-bandgap power devices, including SiC and GaN, play an important role in the propulsion and power systems of drones and eVTOLs, significantly improving system performance and reliability.
EFFICIENCY/RANGE IMPROVEMENT
SiC MOSFET modules, such as 1200V/800A configurations, offer significantly lower switching and conduction losses compared with traditional silicon IGBTs. On 800V platforms, SiC inverters can achieve conversion efficiency above 98%, improving flight endurance and supporting faster charging performance.

Weight Reduction and Higher Power Density

SiC’s high-temperature capability (Tj > 175°C) helps reduce cooling requirements. When combined with double-sided cooling technology, the overall drivetrain weight can be significantly reduced while increasing power density. Compared with conventional systems, this allows for more compact and lightweight designs that are better suited for drones and eVTOL applications.

Improved Reliability

With thermal conductivity approximately three times higher than silicon and strong resistance to harsh operating conditions, SiC power modules provide stable performance in demanding environments and support longer service life compared with traditional silicon-based solutions.

These modules offer greater flexibility in low-altitude aircraft engineering and system design, enabling a wider range of application approaches. This further highlights the advantages of SiC power devices in high-voltage, high-temperature, and high-frequency applications. At the same time, continued development of SiC power modules by companies such as BASiC Semiconductor and Aestech is supporting the advancement of the low-altitude economy supply chain and broader commercial adoption.